| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a filmy adhesive and a production method of a semiconductor device using this which can attain to lower the temperature of chip loading and to conduct a flip chip connection method using ultrasonic vibration by the reduction of melting viscosity. <P>SOLUTION: The filmy adhesive comprises essential ingredients of (a) a resin whose weight average molecular weight is larger than 10,000 and which is a solid form at ordinary temperature (25°C); (b) an insulating spherical inorganic filler; (c) an epoxy resin; (d) a hardener, wherein the minimum melting viscosity is 200 Pa×s or less at a temperature of 50-250°C, and the mean coefficient of linear expansion of a hardened article is at most 200×10<SP>-6</SP>/°C at 25-260°C. The production method of a semiconductor device uses this filmy adhesive. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
