| 摘要 |
PROBLEM TO BE SOLVED: To provide a resist removing agent having excellent removing property even for ashed resist residue while suppressing corrosion or damages on a copper wire or a low-k film considering recent usage of copper lines as a wiring material for a semiconductor device or usage of a film having a low dielectric constant as an insulating film between wires. SOLUTION: The resist removing agent contains a tertiary amine compound, an alkali compound, a fluorine compound and an anionic surfactant. COPYRIGHT: (C)2006,JPO&NCIPI |
