| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic apparatus assembly and a device and a method of assembling the electronic apparatus assembly. <P>SOLUTION: The electronic apparatus assembly (100) having a first layer (110) and a second layer (120) is disclosed. The first layer (110) has a plurality of voids (114) formed on a junction surface (112) and the junction surface (112). The second layer (120) has a plurality of protrusions (124) disposed on a second junction surface (122) and the second junction surface (122), a plurality of the protrusions (124) are aligned with the plurality of the voids (114) and disposed in the plurality of the voids (114). Conductive connection materials (130) are disposed in the plurality of the voids (114) so as to allow connection materials to connect the plurality of the protrusions (124) to the plurality of the voids (114), respectively. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
