| 摘要 |
PROBLEM TO BE SOLVED: To provide a sheet sticking device and a method capable of accurately sticking a sheet onto a surface of a semiconductor wafer or the like. SOLUTION: In the sheet sticking device, a sheet base material S having a die bonding sheet DS superposed on one surface of a base sheet BS is cut to a plane shape of the semiconductor wafer to form a sticking area A1 and the sticking area is stuck onto the semiconductor wafer. The device is provided with a cutting means 15 for forming the sticking area A1 and a peeling off area A2; a first peeling off means 17 for peeling off the peeling off area A2; a sticking table 62 for sticking the sticking area A1 onto the wafer; and a second peeling off means 20 for peeling off the base sheet from the sticking area A1. The cutting means 15 is constituted so as to include first to third cutting blades 31A, 31B, 31C and forms the sticking area A1 by the first cutting blade whereas forms the peeling area A1 by a part of the first cutting blade and the second and third cutting blades. After the peeling off area A2 is peeled off, the sticking area A1 is stuck onto the wafer. COPYRIGHT: (C)2006,JPO&NCIPI |
