发明名称 |
PROCESS FOR THE SINGULATION OF INTEGRATED DEVICES IN THIN SEMICONDUCTOR CHIPS |
摘要 |
<p>A process for the fabrication of an integrated device in a semiconductor chip envisages: forming a semiconductor layer (5') partially suspended above a semiconductor substrate (2) and constrained to the substrate (2) by temporary anchorages (10, 15'); dividing the layer (5') into a plurality of portions (13) laterally separated from one another; and removing the temporary anchorages (10, 15'; 38), in order to free the portions (13).</p> |
申请公布号 |
WO2005104223(A1) |
申请公布日期 |
2005.11.03 |
申请号 |
WO2005EP51694 |
申请日期 |
2005.04.18 |
申请人 |
STMICROELECTRONICS S.R.L.;PONZA, ANNA;DEPETRO, RICCARDO;MONTANINI, PIETRO |
发明人 |
PONZA, ANNA;DEPETRO, RICCARDO;MONTANINI, PIETRO |
分类号 |
H01L21/78;(IPC1-7):H01L21/78 |
主分类号 |
H01L21/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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