发明名称 Basic meterial for patterning and patterning method
摘要 A pattern forming method of the present invention includes the steps of forming, on a substrate before droplets are ejected onto the substrate, a water repelling area, in which a contact angle between the droplet and the target surface is a first contact angle, and a water attracting line, which is adjacent to the water repelling area and in which a second contact angle is smaller than the first contact angle and which is to be the pattern to be formed; and landing droplets onto the target surface such that part of the droplet landed is in a water repelling area and part of the droplet landed is in a water attracting line, the equation ( 1 ) is satisfied, <?in-line-formulae description="In-line Formulae" end="lead"?>D<=LX{1+2(cos theta<SUB>2</SUB>-cos theta<SUB>1</SUB>)} ( 1 ) <?in-line-formulae description="In-line Formulae" end="tail"?> where D is a droplet diameter, L is a pattern width, theta<SUB>1 </SUB>is a first contact angle, and theta<SUB>2 </SUB>is a second contact angle. By decreasing the number of discharged droplets, it is possible to prevent increase of a tact time and decrease of an inkjet operating life.
申请公布号 US2005245079(A1) 申请公布日期 2005.11.03
申请号 US20050525614 申请日期 2005.02.24
申请人 HONDA MITSURU;NAKABAYASHI TAKAYA;FUJII AKIYOSHI 发明人 HONDA MITSURU;NAKABAYASHI TAKAYA;FUJII AKIYOSHI
分类号 B41J2/01;B05D1/26;B41J2/14;B41J2/16;G02F1/1343;H01J9/02;H01L21/288;H01L29/786;H05K3/12;(IPC1-7):H01L21/44 主分类号 B41J2/01
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