ADHESIVE SHEET, SEMICONDUCTOR DEVICE AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE

摘要

An adhesive sheet that can be used for filling for unevenness attributed to wires, etc. attached to semiconductor chips as well as substrate wiring and that is free from resin burrs at the time of dicing and is satisfactory with respect to thermostability and moisture resistance. There is provided an adhesive sheet characterized by containing 100 parts by weight of resin, the resin comprising 15 to 40 wt.% of polymer component of >= 10x10<4> weight average molecular weight and -50˚ to 50˚C Tg containing crosslinking functional groups and 60 to 85 wt.% of thermosetting component composed mainly of an epoxy resin, and 40 to 180 parts by weight of filler, which adhesive sheet has a thickness of 10 to 250 mum.