WIRING BOARD, SEMICONDUCTOR DEVICE AND WIRING BOARD MANUFACTURING METHOD

摘要

A semiconductor device (1) is provided with a package board (2) wherein a plurality of wiring layers are stacked. On a wiring layer, which is an uppermost layer of the package board (2), a plurality of mounting pads (5) are provided in matrix, and solder bumps (7) are connected with the mounting pads (5). A semiconductor chip (9) is mounted on the package board (2) through solder bumps (7). Then, a wiring layer, which is an uppermost layer of the package board (2), is formed of a resin material having a Young's modulus of 1GPa or below at a temperature of 10-30°C, and an elongation quantity of 50% or more at break.