发明名称 |
Substrate processing apparatus and substrate processing method |
摘要 |
A substrate processing apparatus and a substrate processing method can appropriately control the charge of a substrate depending on the type of wet processing, thereby reducing defective processing due to static electricity on the surface of the substrate. The substrate processing apparatus includes: a static electricity adjustment section for adjusting static electricity on a substrate; and a wet processing apparatus for carrying out wet processing of the static electricity-adjusted substrate. The static electricity adjustment section removes static electricity from the substrate or charges the substrate into a desired charged state, for example.
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申请公布号 |
US2005241955(A1) |
申请公布日期 |
2005.11.03 |
申请号 |
US20050111774 |
申请日期 |
2005.04.22 |
申请人 |
MISHIMA KOJI;SUZUKI HIDENAO;NOMURA KAZUFUMI;KANEKO HISASHI;TOYODA HIROSHI |
发明人 |
MISHIMA KOJI;SUZUKI HIDENAO;NOMURA KAZUFUMI;KANEKO HISASHI;TOYODA HIROSHI |
分类号 |
C23C18/18;C23C18/16;C23F1/00;C23F1/08;C23G3/02;C25D5/34;C25D7/12;C25D17/00;C25D21/12;C25F3/12;C25F3/30;C25F7/00;H01L21/00;H01L21/02;H01L21/304;H01L21/306;H01L21/3063;(IPC1-7):C25D5/34 |
主分类号 |
C23C18/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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