| 摘要 |
The present invention is related to a solder ball formation structure for terminal socket, on top of which there is a contact end that extends downward to a extension, and at the end of the terminal socket the wire socket is combined with solder ball. The wire socket appears spherical and curves up. When the curved surface touches the heated solder, the solder is transferred to the curved surface and forms near-spherical solder ball through increasing cohesive force by raising the terminal up. The solder ball sticks to the bottom of the soldering area. The solder balls underneath the terminal through a simple and easy process are uniformly produced, so the quality of the connector is improved by assuring that the solder balls receive the same amount of heat when the connector is attached to a circuit board.
|
