发明名称 |
Bleifreie Lötlegierung und bleifreier Anschluß |
摘要 |
A solder not containing lead (a lead-free solder) contains zinc and tin, and also contains 5 weight percent or less nickel and 0.5 weight percent or less aluminum with a liquid phase temperature of 260 degrees C. or greater. In addition, a lead-free solder has a liquid phase temperature of 260 degrees C. or greater, and contains 30 to 70 weight percent zinc, 5 weight percent or less nickel, and the remaining weight percent tin. Moreover, a joint is manufactured using these lead-free solders. As a result, a lead-free solder and a lead-free joint having excellent electrical characteristics but not including harmful substances, can be provided. |
申请公布号 |
DE10392947(T5) |
申请公布日期 |
2005.11.03 |
申请号 |
DE2003192947T |
申请日期 |
2003.10.23 |
申请人 |
KOA KABUSHIKI KAISHA, INA;SOLDERCOAT CO., LTD.;OKABE GIKEN CO., LTD. |
发明人 |
KOBAYASHI, SATORU;KATO, KAZUYUKI;SUGIURA, MASAHIRO;OKABE, SABURO |
分类号 |
B23K35/26;B23K35/28;C22C13/00;C22C18/00;C23C2/06;H05K3/34;(IPC1-7):C22C18/00 |
主分类号 |
B23K35/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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