发明名称 Bleifreie Lötlegierung und bleifreier Anschluß
摘要 A solder not containing lead (a lead-free solder) contains zinc and tin, and also contains 5 weight percent or less nickel and 0.5 weight percent or less aluminum with a liquid phase temperature of 260 degrees C. or greater. In addition, a lead-free solder has a liquid phase temperature of 260 degrees C. or greater, and contains 30 to 70 weight percent zinc, 5 weight percent or less nickel, and the remaining weight percent tin. Moreover, a joint is manufactured using these lead-free solders. As a result, a lead-free solder and a lead-free joint having excellent electrical characteristics but not including harmful substances, can be provided.
申请公布号 DE10392947(T5) 申请公布日期 2005.11.03
申请号 DE2003192947T 申请日期 2003.10.23
申请人 KOA KABUSHIKI KAISHA, INA;SOLDERCOAT CO., LTD.;OKABE GIKEN CO., LTD. 发明人 KOBAYASHI, SATORU;KATO, KAZUYUKI;SUGIURA, MASAHIRO;OKABE, SABURO
分类号 B23K35/26;B23K35/28;C22C13/00;C22C18/00;C23C2/06;H05K3/34;(IPC1-7):C22C18/00 主分类号 B23K35/26
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