METHOD FOR APPLYING A CURED COVERING LAYER ON A SUBSTRATE

摘要

The invention relates to a method for applying a covering layer (3, 12, 17) to a substrate (5, 11, 19), comprising of applying an adhesive layer (6, 13, 20) in non-cross-linked state to the substrate and applying thereto a cross-linked covering layer, characterized in that the covering layer is provided with openings (4), and to a method for manufacturing a coating package, and use of the coating package.