发明名称 Method for processing by laser, apparatus for processing by laser, and three-dimensional structure
摘要 A laser processing method where laser beam for processing is irradiated on a processing object and the laser beam for processing directly removes a part of the processing object. The processing object is made of a glass substrate, metal thin film having high absorption to laser beam for processing is formed on a surface of glass substrate, into which laser beam for processing is made incident, the laser beam for processing is irradiated from a surface of metal thin film, and matter is directly removed by irradiation of laser beam onto the processing object in order to form a region finer than an irradiation region of laser beam for processing on the processing object.
申请公布号 US2005244622(A1) 申请公布日期 2005.11.03
申请号 US20050174471 申请日期 2005.07.06
申请人 YAMADA YASUFUMI;MIDORIKAWA KATSUMI;KUMAGAI HIROSHI 发明人 YAMADA YASUFUMI;MIDORIKAWA KATSUMI;KUMAGAI HIROSHI
分类号 B81C1/00;B23K26/00;B23K26/06;B23K26/073;B23K26/18;B23K26/38;C03C17/00;C03C17/06;C03C23/00;H05K1/03;H05K3/00;H05K3/02;(IPC1-7):B32B15/00 主分类号 B81C1/00
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