发明名称 |
Method for processing by laser, apparatus for processing by laser, and three-dimensional structure |
摘要 |
A laser processing method where laser beam for processing is irradiated on a processing object and the laser beam for processing directly removes a part of the processing object. The processing object is made of a glass substrate, metal thin film having high absorption to laser beam for processing is formed on a surface of glass substrate, into which laser beam for processing is made incident, the laser beam for processing is irradiated from a surface of metal thin film, and matter is directly removed by irradiation of laser beam onto the processing object in order to form a region finer than an irradiation region of laser beam for processing on the processing object.
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申请公布号 |
US2005244622(A1) |
申请公布日期 |
2005.11.03 |
申请号 |
US20050174471 |
申请日期 |
2005.07.06 |
申请人 |
YAMADA YASUFUMI;MIDORIKAWA KATSUMI;KUMAGAI HIROSHI |
发明人 |
YAMADA YASUFUMI;MIDORIKAWA KATSUMI;KUMAGAI HIROSHI |
分类号 |
B81C1/00;B23K26/00;B23K26/06;B23K26/073;B23K26/18;B23K26/38;C03C17/00;C03C17/06;C03C23/00;H05K1/03;H05K3/00;H05K3/02;(IPC1-7):B32B15/00 |
主分类号 |
B81C1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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