| 发明名称 |
Flip chip bonding tool and ball placement capillary |
| 摘要 |
A flip chip bonding tool and ball placement capillary system comprising a dissipative material with a resistance low enough to prevent a discharge of a charge to a device being bonded and high enough to avoid current flow to the device being bonded is disclosed.
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| 申请公布号 |
US2005242155(A1) |
申请公布日期 |
2005.11.03 |
| 申请号 |
US20050107308 |
申请日期 |
2005.04.15 |
| 申请人 |
|
发明人 |
REIBER STEVEN F. |
| 分类号 |
B23K1/00;B23K3/06;B23K3/08;B23K37/00;H01L21/60;(IPC1-7):B23K37/00 |
主分类号 |
B23K1/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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