发明名称 |
Printed circuit board and method for processing printed circuit board |
摘要 |
The invention is to provide a printed circuit board in which advance of packaging density of the printed circuit board and reduction in production cost can be attained while processing quality can be made uniform, a method for processing the printed circuit board and a method for producing the printed circuit board. There is provided a printed circuit board including an alternate laminate of electric conductor layers and electrically insulating layers, wherein a coating layer capable of absorbing laser light but insoluble in an etching solution dissolving the electric conductor layers is provided on a front surface of a first one of the electric conductor layers. In this case, the coating layer may be provided on a front surface of a rear one of the electric conductor layers. Each of the electric conductor layers may contain Cu as a main component while the coating layer may contain CuO as a main component. The coating layer may have a thickness not thinner than 0.6 mum.
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申请公布号 |
US2005244621(A1) |
申请公布日期 |
2005.11.03 |
申请号 |
US20050117505 |
申请日期 |
2005.04.29 |
申请人 |
HITACHI VIA MECHANICS LTD. |
发明人 |
ARAI KUNIO;AKAHOSHI HARUO |
分类号 |
B32B3/00;H05K1/02;H05K3/00;H05K3/06;H05K3/42;H05K3/46;(IPC1-7):B32B3/00 |
主分类号 |
B32B3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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