Deposition thickness measuring method, material layer forming method, deposition thickness measuring apparatus, and material layer forming apparatus

摘要

Light emitted from a light emitting device is irradiated onto a film thickness monitoring region and the light conveyed from the monitoring region is detected by a light receiving device. The light emitting device and the light receiving device may be provided within the film forming chamber. The absorption intensity or fluorescence intensity or X ray intensity or the reflection rate at the monitoring region which is formed on a portion of the substrate from the same material as the material layer at the time of deposition is detected based on data from the light receiving device. A controller then controls the transporting rate of a deposition source and/or the heating state of a heater to adjust the deposition rate, whereby a material layer having a desired thickness is formed on the substrate.