A microchannel heat sink as well as method includes one or more microchannels through which a working fluid flows to remove heat from a heat-generating component, such as a microelectronic chip, and one or more recesses disposed in a surface communicated to the one or more of the microchannel to enhance heat transfer rate of the microchannel heat sink. The, recesses can be located in a surface of a cover that closes off the microchannels. The one or more recesses can be located at one or more local hot spot regions to enhance heat transfer rates at the local regions as well as overall heat removal rate of the heat sink.
申请公布号
WO2005104323(A2)
申请公布日期
2005.11.03
申请号
WO2004US42801
申请日期
2004.12.08
申请人
PURDUE RESEARCH FOUNDATION;LEE, POH-SENG;GARIMELLA, SURESH, V