| 摘要 |
A folded, fully buffered memory module comprising: a planar flexible circuit medium; first and second generally quadrangular printed circuit leaves flexibly joined in juxtaposed, spaced disposition by the flexible circuit medium, the flexible circuit medium including a network of conductive leads for signal communication between the leaves, the flexible medium being folded to an extent that the leaves are adjacent and parallel to each other; a memory buffer disposed centrally on a face of the second leaf; a plurality of memory devices distributed on the leaves in a star topology about the memory buffer. Preferably the backside of the memory buffer is clear enough for close decoupling of the buffer. Preferably the memory devices are staggered to allow close decoupling of the each memory devices at its backside. |
