Semiconductor system comprises substrate with contact pad connected to e.g. solder beads, system being encapsulated on at least five sides and mechanical decoupling system mounted between encapsulation and semiconductor

摘要

Semiconductor system comprises a substrate (10) with a contact pad (11) which is connected by conductors (12) to connectors, e.g. solder beads (13). The system is encapsulated (14) on at least five sides and a mechanical decoupling system (15) is mounted between the encapsulation and the semiconductor. An independent claim is included for a method for making the semiconductor system.