| 摘要 |
One embodiment of the invention is a method for void-free filling with a metal or an alloy inside narrow openings by electrochemical deposition (ECD), said method including steps of: (a) providing a substrate with electrically conductive surface, said conductive surface including at least one opening and a field surrounding the at least one opening, said narrow opening having a width from about 0.05 mum to about 0.10 mum, or less, near its bottom; (b) immersing the substrate in an electrolyte contained in an electrochemical deposition (ECD) cell, the ECD cell including at least one anode and a cathode, wherein the cathode including at least a portion of the conductive surface including the at least one opening of the substrate, and wherein the electrolyte includes plating metallic ions and at least one inhibitor additive; (c) providing substantially uniform agitation of the electrolyte across the electrically conductive surface of the substrate immersed in the electrolyte; and (d) applying electrical current between the at least one anode and the cathode to generate an electroplating current density of at least 15 mA/cm<SUP>2</SUP>. |
