发明名称 |
DIELECTRIC BARRIER LAYER FILMS |
摘要 |
In accordance with the present invention, a dielectric barrier layer is presented. A barrier layer according to the present invention includes a densified amorphous dielectric layer deposited on a substrate by pulsed-DC, substrate biased physical vapor deposition, wherein the densified amorphous dielectric layer is a barrier layer. A method of forming a barrier layer according to the present inventions includes providing a substrate and depositing a highly densified, amorphous, dielectric material over the substrate in a pulsed-dc, biased, wide target physical vapor deposition process. Further, the process can include performing a soft-metal breath treatment on the substrate. Such barrier layers can be utilized as electrical layers, optical layers, immunological layers, or tribological layers. |
申请公布号 |
WO2004077519(A9) |
申请公布日期 |
2005.11.03 |
申请号 |
WO2004US05531 |
申请日期 |
2004.02.26 |
申请人 |
NARASIMHAN, MUKUNDAN;DEMARAY, RICHARD, E.;BROOKS, PETER |
发明人 |
NARASIMHAN, MUKUNDAN;DEMARAY, RICHARD, E.;BROOKS, PETER |
分类号 |
C23C14/34;C23C14/35;H01L21/314;H01L21/316;H01L51/52 |
主分类号 |
C23C14/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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