Wiring board e.g. for mobile communications device or computer, has insulating pattern formed on substrate, intersecting wiring pattern to define electrode

摘要

The wiring board includes a substrate (1) with a wiring pattern (4) and a insulating pattern (8) that is formed on the substrate in such a way that it intersects the wiring pattern and defines part of the wiring pattern as a connection region electrode (7). A further insulating pattern may be formed on the substrate, parallel to the first insulating pattern. Independent claims are included for a method of manufacturing a wiring board, a method of manufacturing a wiring pattern, and an electrical device provided with the wiring board.