Method for photocuring of resin compositions

摘要

The invention relates to methods for Light Emitting Diode (LED) curing of a curable resin composition containing a photoinitiating system, wherein the highest wavelength (λ<Sub>max PIS</Sub>) of a maximum in absorption of the photoinitiating system is at least 20 nm below, and at most 100 nm below, the wavelength of the maximum in emission of the LED (λ<Sub>LED</Sub>). The invention also relates to use of LED curing in structural applications, in particular in applications for lining or re-lining of objects and to objects containing a cured resin composition obtained by LED curing.