Process and device for laser cutting

摘要

The laser cutting method involves guiding a laser beam (8) along a first cut line (10) to separate the workpiece (3) and sucking out the resulting gases and/or vapors. The workpiece to be separated during the cutting process is provided with a suction opening (27) and the gases and/or vapors are sucked out (19) via this opening during the cutting process. AN Independent claim is also included for the following: (a) a laser cutting arrangement.