发明名称 THERMOSETTING, THEMOEXPANSIBLE COMPOSITION WITH A HIGH DEGREE OF EXPANSION
摘要 <p>Compositions containing at least one liquid epoxy resin, at least one solid epoxy resin, at least one propellant, at least one curing agent and at least one mica-containing filler produce expandable, thermally curable binder systems which may be used without the addition of hollow glass beads for the production of stiffening and reinforcing laminates and for the production of stiffening and reinforcing moldings. Said laminates according to the invention are suitable for the stiffening and reinforcing of components, in particular in the automotive industry, such as car body frames, doors, boot lids, engine bonnets and/or roof parts. In addition, the mouldings that may be produced from said binders are suitable for the stiffening and reinforcing of hollow metal structures, in particular of hollow car body parts such as body frames, body supports and posts or doors in the automotive industry.</p>
申请公布号 EP1590403(A1) 申请公布日期 2005.11.02
申请号 EP20040703364 申请日期 2004.01.20
申请人 HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN 发明人 MUENZ, XAVER;BOBB, LARISSA
分类号 C08J9/00;C08J9/32;C08L9/02;C08L63/00;(IPC1-7):C08L63/00;C08K7/22;C08K3/34 主分类号 C08J9/00
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