发明名称 |
Capacitor, capacitor equipped semiconductor device assembly, capacitor equipped circuit substrate assembly and electronic unit including semiconductor device, capacitor and circuit substrate |
摘要 |
A capacitor includes a capacitor main body having a front surface on which a semiconductor device is to be mounted and a rear surface at which the capacitor main body is to be mounted on a first main surface of a circuit substrate, a plurality of internal electrodes disposed within the capacitor main body, and a plurality of via conductors penetrating the capacitor main body between the front surface and the rear surface and electrically connected to the internal electrodes, wherein the capacitor main body has a first dielectric layer located on a side of the capacitor main body closer to the front surface and a second dielectric layer located on a side of the first dielectric layer closer to the rear surface, the second dielectric layer having a higher thermal expansion coefficient and a higher dielectric constant than the first dielectric layer.
|
申请公布号 |
US6961230(B2) |
申请公布日期 |
2005.11.01 |
申请号 |
US20040862562 |
申请日期 |
2004.06.08 |
申请人 |
NGK SPARK PLUG CO., LTD. |
发明人 |
OTSUKA JUN;SATO MANABU;KIMURA YUKIHIRO |
分类号 |
H01G2/06;H01G4/30;H01L23/498;H01L23/50;H01L25/00;H05K1/14;H05K1/16;H05K1/18;(IPC1-7):H01G4/228 |
主分类号 |
H01G2/06 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|