| 发明名称 |
Reinforced bond pad |
| 摘要 |
Disclosed herein is a reinforcing system and method for reinforcing a contact pad of an integrated circuit. Specifically exemplified is a system and method that comprises a reinforcing structure interposed between a top contact pad layer and an underlying metal layer.
|
| 申请公布号 |
US6960836(B2) |
申请公布日期 |
2005.11.01 |
| 申请号 |
US20030675260 |
申请日期 |
2003.09.30 |
| 申请人 |
AGERE SYSTEMS, INC. |
发明人 |
BACHMAN MARK ADAM;CHESIRE DANIEL PATRICK;MERCHANT SAILESH MANSINH;OSENBACH JOHN WILLIAM;STEINER KURT GEORGE |
| 分类号 |
H01L21/60;H01L23/00;H01L23/485;(IPC1-7):H01L23/52 |
主分类号 |
H01L21/60 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
