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发明名称
Plating Cu,Ni and Au on PCB in a single process
摘要
申请公布号
KR100525224(B1)
申请公布日期
2005.10.28
申请号
KR20020087580
申请日期
2002.12.30
申请人
发明人
分类号
H05K3/18;(IPC1-7):H05K3/18
主分类号
H05K3/18
代理机构
代理人
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地址
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