Coating mass e.g. adhesive, applying method, involves applying glue components on glue zone using micro-metering valves, and applying thermo-conducting paste in intervals of glue points formed by mixing components

摘要

The method involves applying glue components (12, 14) on a glue zone (13) of a substrate constituting metering zone, with the help of micro-metering valves (6, 9) of a coating applying device (5). The components are mixed for forming glue points (4). A thermo-conducting paste is applied in intervals of the glue points with the help of the applying device. Independent claims are also included for the following: (A) a method of fabricating semi-conductor module (B) a device for applying a coating mass.