发明名称 |
TAPE SUBSTRATES WITH MOLD GATE SUPPORT STRUCTURES THAT ARE COPLANAR WITH CONDUCTIVE TRACES THEREOF AND ASSOCIATED METHODS |
摘要 |
A system for degating a packaged semiconductor device that includes a tape substrate includes a first element and a second element. The first element of the system is positionable adjacent to a first major surface of the packaged semiconductor device and includes a receptacle for receiving a portion of a gate of the packaged semiconductor device. A second element of the degating system is positionable adjacent to a second major surface of the packaged semiconductor device and includes a degating element alignable with the gate. The degating element is extendable through the gate to force a portion of the gate and a sprue therein into the receptacle of the first element. |
申请公布号 |
SG115569(A1) |
申请公布日期 |
2005.10.28 |
申请号 |
SG20030005841 |
申请日期 |
2003.09.09 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
LEE TECK KHENG;M VIJENDRAN |
分类号 |
H01L21/56;H01L23/13;H01L23/31;H01L23/48;H01L23/498 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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