发明名称 CERAMIC ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To prevent an external terminal electrode from fracturing when an aggregate electronic component in which a conductor for a terminal to be used as the external terminal electrode is installed in advance is divided to obtain a ceramic electronic component. SOLUTION: By forming longitudinal through-holes 48 with reference to a raw ceramic molding 47, in which a plurality of conductors 45 for terminals to be used as external terminal electrodes are installed, a part in each of the conductors 45 for the terminals is exposed on the inside of the through holes 48. After the ceramic molding 47 is fired to be obtained a ceramic sinter, by dividing along cutting grooves 51 passing the through holes 48, the ceramic electronic component is taken out. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005303311(A) 申请公布日期 2005.10.27
申请号 JP20050114567 申请日期 2005.04.12
申请人 MURATA MFG CO LTD 发明人 SAKAI NORIO
分类号 H01G4/12;H01F27/29;H01F41/10;H01G4/252;H01G4/30;(IPC1-7):H01G4/30 主分类号 H01G4/12
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