发明名称 WIRING CIRCUIT SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a flexible wiring circuit substrate capable of relaxing a stress generated at a portion adjacent to a bent portion in a reinforced plate even though the substrate is repeatedly bent while coping with miniaturization in the recent years and capable of improving reliability by preventing the breakdown of the wiring circuit pattern. SOLUTION: In the flexible wiring circuit substrate 1 provided with a reinforced portion 8 where the reinforced plate 7 is formed and the bent portion 9 where the reinforced plate 7 is not formed, wherein the reinforced plate 7 is connected to a mounting support section 11 and the mounting support section 11, is disposed so as to be adjacent to the bent portion 9, and is formed so as to be two steps with a stress relaxing section 12 thinner than that of the mounting support section 11. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005303172(A) 申请公布日期 2005.10.27
申请号 JP20040120112 申请日期 2004.04.15
申请人 NITTO DENKO CORP 发明人 MOTOGAMI MITSURU
分类号 H05K1/02;(IPC1-7):H05K1/02 主分类号 H05K1/02
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