WAFER PROCESSING DEVICE AND WAFER PROCESSING METHOD

摘要

A sticking device (15) is constructed from a sticking table (40) supporting a semiconductor wafer (W), a sticking unit (41) for sticking a heat-sensitive adhesive sheet (S), and a cutter (96) for cutting the adhesive sheet crosswise and peripherally for each semiconductor wafer. The table comprises the first sticking table (40) controlled to a first temperature for temporarily sticking the adhesive sheet (S) to the wafer (W), an outer periphery cutting table (47) controlled to a second temperature which lowers the stickiness of the adhesive sheet for cutting the latter, and a connecting table (48) controlled to a third temperature for completely sticking the adhesive sheet (S) to the wafer (W).