| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a high-strength and stable substrate holding power, to simplify a structure, to reduce costs, to improve durability, to remarkably suppress the warp of a printed circuit board, and to reduce packaging defects in a substrate holding fixture, substrate holding structure and component packaging method used for a reflow soldering step when packaging electronic components on the printed circuit board. <P>SOLUTION: A substrate holding fixture 10 is comprised of a metal plate 11 including a holding surface 11a for holding a printed circuit board 14 thereon, and fixing pawls 12 provided at positions corresponding to through-holes 15 close to four corners of the printed circuit board 14 on the holding surface 11a of the metal plate 11, and formed with a substrate press-in 13 which becomes smaller than or equal with the thickness of the printed circuit board 14, with the holding surface 11a. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
