| 发明名称 |
CIRCUIT BOARD ASSEMBLY MANUFACTURING METHOD AND CIRCUIT BOARD MANUFACTURING DEVICE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit board assembly manufacturing method and a circuit board assembly manufacturing device having high precision and high processing efficiency based on press setting factors determined by factors other than force applied on a work. <P>SOLUTION: A load by which a press unit is operated is set for every item number of a printed circuit board. The terminal inserting holes of the printed circuit board to be processed are photographed one by one, and the diameter of each photographed terminal inserting hole is operated. Based on the operated diameter, whether the printed circuit board is acceptable or not is determined. The average value of the diameters of the terminal inserting holes of the printed circuit board determined to be acceptable is found. A press-in load set for the press unit is corrected based on the operated average value of the hole diameter. A press processing is applied to a work determined to be acceptable by operating the press unit by this corrected load. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
| 申请公布号 |
JP2005302520(A) |
申请公布日期 |
2005.10.27 |
| 申请号 |
JP20040116823 |
申请日期 |
2004.04.12 |
| 申请人 |
AUTO NETWORK GIJUTSU KENKYUSHO:KK;SUMITOMO WIRING SYST LTD;SUMITOMO ELECTRIC IND LTD |
发明人 |
SHIODA RYOSUKE |
| 分类号 |
B23P19/02;H01R43/20;H05K13/04;H05K13/08 |
主分类号 |
B23P19/02 |
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