| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method and apparatus for automatic wiring which automate wiring designing of a semiconductor package, having a multistage bonding pad where a plurality of pads connected to a semiconductor chip are arrayed, and to provide a method and apparatus for automatic discrimination that accurately discriminate an array that a pad belongs to. <P>SOLUTION: The automatic wiring apparatus 1 for the semiconductor package determines an optimum wiring route from each pad to a desired corresponding via in the multistage bonding pad, where the plurality of the pads connected to the semiconductor chip are arrayed. The apparatus 1 is equipped with an array discriminating means 11 for discriminating which array each pad belongs to, a temporary arrangement means 12 for allocating the position of each pad discriminated by the array discriminating means as to which array the pad belongs to a position in a matrix table, and a determining means 13 for determining the optimum wiring route according to the matrix table generated by the temporary arrangement means 12. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
