Process for application of a thin metal adhering coating as a carrier for a functional layer, especially for a heat resistant ceramic top layer on a metal substrate useful in coating turbine engine parts of complex configuration

摘要

Process for application of a thin metal adhering coating as a carrier for a functional layer, especially for a heat resistant ceramic top layer on a metal substrate using a high temperature solder. The carrier layer is so prepared that a solder paste from a solder alloy powder and a non-melting metal powder is applied to the substrate surfaces to be coated with deposition of a low porosity, rough surface adhering layer by vacuum annealing or under a shielding gas atmosphere.