PROCESS FOR PRODUCING SEMICONDUCTOR CHIP MOUNTING BODY, AND SEMICONDUCTOR CHIP MOUNTING BODY

摘要

PROBLEM TO BE SOLVED: To provide a process for producing a semiconductor chip mounting body having a semiconductor chip and a wiring board, and to cover the semiconductor chip with resin of intended shape in the semiconductor chip mounting body thus produced.

SOLUTION: The process for producing a semiconductor chip mounting body comprises a step for assembling the mounting body of a semiconductor chip such that the gap between a wiring board and the semiconductor chip is filled with underfill resin and the semiconductor chip is flip-chip connected on the wiring board, a step for arranging a thermosetting resin sheet having an area larger than that of the exposed surface of the flip-chip connected semiconductor chip on the exposed surface, and a step for heating the thermosetting resin sheet arranged on the exposed surface of the semiconductor chip and sealing the semiconductor chip with the thermosetting resin sheet to cover the exposed surface.

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