| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an antenna-integrated type semiconductor device which can improve communication performance without an increase in package size. <P>SOLUTION: The antenna-integrated type semiconductor device is provided with; a semiconductor chip 2, a mounting part 5 for mounting the semiconductor chip 2, and an antenna. The antenna is composed of two or more coils 3 and 4 which overlap each other. The terminal pad of the semiconductor chip 2 is connected to both sides of the antenna and sealed with a sealing resin. The plurality of coils 3 and 4 are put on the other and sealed together, or each of the coils 3 and 4 is separately sealed, put on the other and then connected with external connection leads 12 and 13. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
