NON-CONTACT TYPE DATA CARRIER, METHOD FOR MANUFACTURING THE SAME AND LEAD FRAME FOR SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a non-contact data carrier suitable for mass production, its manufacturing method and a lead frame for a semiconductor package.

SOLUTION: The connection part of a coil-shaped lead 2 is cut from a sealing resin opening 9 installed in a semiconductor package so that the respective circumferences of the coil-shaped lead can be separated. Thus, it is possible to prevent the deformation of the coil-shape at the time of molding or dealing with the sealing resin or short-circuit due to this.

COPYRIGHT: (C)2006,JPO&NCIPI