发明名称 THERMAL ENVIRONMENT PREDICTION METHOD FOR INSIDE/OUTSIDE OF BUILDING
摘要 PROBLEM TO BE SOLVED: To provide a thermal environment prediction method and its device for the inside/outside of a building capable of simultaneously and precisely evaluating heat environments of the inside and the outside of a building by efficiently interlocking a tool simulating an exterior thermal environment by means of a 3-D CAD and a building heat load simulation tool while making good use of characteristics/merits of these analytical techniques. SOLUTION: When an analysis technique for calculating heat receipt quantity and a surface temperature distribution on the overall surface of a building, the ground, and the like by means of a 3-D CAD and a building heat load calculation technique are carried out cooperatively for analysis while setting a boundary between both technique on the outside surface of the building, heat flow of a building armour, surface temperature on the overall surfaces of the inside and the outside of the building, a room temperature inside the building, a building heat load, and artificial heat emission quantity are predicted while taking a spatial form of the exterior space and structural materials into consideration. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005301487(A) 申请公布日期 2005.10.27
申请号 JP20040114006 申请日期 2004.04.08
申请人 RIKOGAKU SHINKOKAI 发明人 UMEBOSHINO AKIRA;ASAWA TAKASHI
分类号 E04B1/00;G06F17/50;(IPC1-7):G06F17/50 主分类号 E04B1/00
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