| 摘要 |
PROBLEM TO BE SOLVED: To provide a marking method to semiconductor substrate for applying a marking that has excellent durability and discrimination property. SOLUTION: In the marking method to a semiconductor substrate, a pattern of a desired shape is formed by injecting colored ink from an ink jet nozzle to a semiconductor substrate 1. Therein, an ink-repellent film 22 is formed with a pattern of trimming a marking object part becoming the pattern of a desired shape using the colored ink disposed on the semiconductor substrate 1 by injecting ink-repellent liquid 21 from an ink jet nozzle 11 and, subsequently, a colored ink film 24 is formed by injecting colored ink 23 inside the ink-repellent film 22 from an ink jet nozzle 13. COPYRIGHT: (C)2006,JPO&NCIPI
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