| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a compound semiconductor light emitting element provided with side faces having large surface areas, and to provide a method of manufacturing the element. <P>SOLUTION: In the method of manufacturing the compound semiconductor light emitting element, the light emitting element is manufactured by laminating a compound semiconductor layer containing a light emitting layer composed of n- or p-type compound semiconductor upon a wafer which becomes a substrate and arranging a negative pole and a positive pole used for making a driving current to flow to the light emitting layer at prescribed positions. Then separating zones are provided for separating individual light emitting elements in such a way that many small holes may be arranged linearly along the separating zones. Thereafter, the light emitting layer is divided into the individual light emitting elements along the separating zones. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
