| 摘要 |
PROBLEM TO BE SOLVED: To prevent the degradation of wafer surface quality after cleaning by keeping the wafer surface hydrophilic after finish polishing. SOLUTION: The rinse polishing liquid is for use in the rinse polishing process to be implemented after semiconductor wafer finish polishing. The liquid contains at least one substance, or one mixture of at least two substances selected from the group consisting of organic compounds having an imino group, organic compounds having an alcoholic hydroxy group, and water-soluble polymers other than ones included in the organic compounds. COPYRIGHT: (C)2006,JPO&NCIPI
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