发明名称 VAPOR DEPOSITION SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a vapor deposition system where the loss of an evaporation material can be effectively reduced for example. SOLUTION: The vapor deposition system is provided with: an evaporation part 4a for heating a material storage vessel 21 and evaporating the material; a vapor deposition part 3a for sticking the evaporation material to the member to be vapor-deposited; and a communication part 9a for introducing the evaporation material from the evaporation part 4a into the vapor deposition part 3a. By arranging valve holes 41d provided at the communication part 9a, a vessel reciprocation apparatus 20 for fitting the material storage vessel 21 into the communication part 9a and further reciprocating the same to the approach-separation direction to each valve hole 41d, and a flow rate control apparatus 40 with a stop valve 42 capable of regulating the flow rate of the evaporation material in the communication part 9a, and fitting the material storage vessel 21 into the communication part 9a by the vessel reciprocation apparatus 20, the material storage vessel 21 and the communication part 9a are connected to an almost airtight state. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005298926(A) 申请公布日期 2005.10.27
申请号 JP20040118450 申请日期 2004.04.14
申请人 HITACHI ZOSEN CORP 发明人 DAIKU HIROYUKI;INOUE TETSUYA;MORIUCHI HIROAKI
分类号 C23C14/24;(IPC1-7):C23C14/24 主分类号 C23C14/24
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