| 摘要 |
A method for patterning a device layer, for example of an organic electronic or optoelectronic device, using a patterned stamp. The method comprising the steps of (a) providing a substrate, (b) bringing the patterned stamp into contact with the substrate, (c) removing the patterned stamp from the substrate, characterized in that step (b) is carried out so that the surface energy of the substrate is modified in accordance with the pattern, and that the method further comprises a step (d) depositing a solution of a device layer on the substrate after the patterned stamp has been removed, whereby the surface energy of the substrate determines the deposition pattern of the device layer. |
