METHOD OF PACKAGING MEMS DEVICE IN VACUUM STATE AND MEMS DEVICE VACUUM-PACKAGED USING THE SAME

摘要

Provided are a method of packaging an MEMS device in vacuum using an O-ring and a vacuum-packaged MEMS device manufactured by the same. The method includes preparing an upper substrate including a cavity and a lower substrate including the MEMS device and loading the upper and lower substrates into a vacuum chamber; aligning the lower and upper substrates by mounting an O-ring on a marginal portion of the MEMS device of the lower substrate; compressing the O-ring between the upper and lower substrates by applying a pressure between the upper and lower substrates; venting the vacuum chamber; and removing the pressure applied between the upper and lower substrates. In this method, an MEMS device can be packaged in vacuum using a simple process without causing outgassing and leakage from a cavity of the upper substrate.