发明名称 HEAT SINK
摘要 PROBLEM TO BE SOLVED: To solve the problem that it is difficult to attain the performance enough for sufficiently radiating heat of electronic apparatus which is manufactured in large number in recent years in the heat sink formed to improve heat transfer effect by utilizing disturbed flowing effect which is realized by providing pin-type fins in the two-dimensional flow. SOLUTION: The heat sink provided with a cooling fluid charging port, a heat transfer vessel in which a flowing path is formed, and a cooling fluid discharging port. In this heatsink, the flowing path is constituted by sequentially coupling an almost trapezoidal flowing path, in which the flowing path becomes small in the height direction of the heat transfer vessel from the side where a heat generating body is mounted, to a flowing path in which the flowing path is almost constant. Therefore, the heat transfer characteristic can be improved with the more simplified structure by generating the three-dimensional flow. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005302898(A) 申请公布日期 2005.10.27
申请号 JP20040114587 申请日期 2004.04.08
申请人 MITSUBISHI ELECTRIC CORP 发明人 IPPOSHI SHIGETOSHI;OGUSHI TETSURO;HASHIMO SEIJI;KIMURA SUSUMU;YAMADA AKIRA;YAMABUCHI HIROSHI;MURAHATA AKIHIRO;OKAYAMA HIDEO;UEHARA NOBUAKI
分类号 H01L23/473;H01L23/36;(IPC1-7):H01L23/473 主分类号 H01L23/473
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