| 摘要 |
PROBLEM TO BE SOLVED: To inexpensively provide a semiconductor device that cools a semiconductor chip 2a which is a heating element with low thermal resistance and, at the same time, can prevent the leakage of a cooling medium. SOLUTION: The semiconductor device has a base plate 1 having a first main surface 15a and a second main surface 15b facing the first main surface 15a, a semiconductor chip 2a bonded to the first main surface 15a, and a heat sink 8 on which the semiconductor chip 2a is mounted. The heat sink 8 has a main body section 3 having a joint surface 16 bonded to the second main surface 15b and a pressing section 4 arranged in the outer peripheral portion of the first main surface 15a. The main body section 3 and pressing section 4 hold the base plate 1 in between and a first opening 9 is formed in the joint surface 16 correspondingly to the position of the semiconductor chip 2a. The cooling medium flowing through a cooling medium room 11 surrounded by the inside of the main body section 3 and the second main surface 15b exposed from the first opening 9 directly comes into contact with the second main surface 15b through the first opening 9. COPYRIGHT: (C)2006,JPO&NCIPI |
