| 摘要 |
PROBLEM TO BE SOLVED: To provide a forming method of a metal coated liquid crystal polymer film useful as an electronic insulating material, excellent in heat resistance, chemical resistance, electrical properties (electric insulating properties, dielectric properties or the like) and the like and also excellent in compatibility and adhesion with a copper conductive layer even in a state that a metal seed layer capable of being formed on a thermoplastic liquid crystal polymer film by a sputtering method, the copper conductive layer formed on the metal seed layer by a sputtering method and the copper conductive layer further formed on the copper conductive layer by a wet plating method are laminated. SOLUTION: After discharge plasma treatment is applied to the surface of the thermoplastic liquid crystal polymer film in an atmosphere with an oxygen gas pressure of 0.6-2.5 Pa, the metal seed layer and the copper conductive layer are successively formed by sputtering so that the sum total film thickness becomes 0.05-1μm and the copper conductive layer is subsequently formed by a wet plating method so that the sum total film thickness becomes 1-30μm. COPYRIGHT: (C)2006,JPO&NCIPI |
